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Elec 499 Project
PC Performance Maximization through the use of Overclocking and Active Cooling

Warren Little, Electrical Engineering Department

Team Members
Dale Gagne
Jason Vath

With the advent of rising clock rates in personal computers, the requirement for improved thermal management of the microprocessor and other components becomes a necessity. Through improved thermal management, we strive to extend the boundaries of PC performance.

To understand the operational characteristics and limitations of an Intel based PC. Once limitations are understood the team will strive to maximize performance through active cooling methods on the microprocessor and chipset.

1. The relationship between computational performance and front side bus speed will be analyzed.

2. The correlation between increased front side bus speed and processor heat dissipation will be examined.

3. The relationship between processor temperature and operational stability will be characterized.

4. Alternative methods for active cooling of the processor and chipset will be studied and employed to further extend thermal stability limitations.

5. Temperature regulation of the processor and its feasibility will be investigated.

6. All designs will minimize the probability of condensation occurring within the PC.

University of Victoria    Faculty of Engineering    Dept. of Electrical Engineering
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Last updated: April 6, 2001.