Elec 499 Project
PC Performance Maximization through the use of Overclocking and Active Cooling
Warren Little, Electrical Engineering Department
With the advent of rising clock rates in personal computers, the requirement for
improved thermal management of the microprocessor and other components becomes a
necessity. Through improved thermal management, we strive to extend the
boundaries of PC performance.
To understand the operational characteristics and limitations of an Intel based
PC. Once limitations are understood the team will strive to maximize performance
through active cooling methods on the microprocessor and chipset.
1. The relationship between computational performance and front side bus speed
will be analyzed.
2. The correlation between increased front side bus
speed and processor heat dissipation will be examined.
3. The relationship between processor temperature
and operational stability will be characterized.
4. Alternative methods for active cooling of the
processor and chipset will be studied and employed to further extend thermal
5. Temperature regulation of the processor and its
feasibility will be investigated.
6. All designs will minimize the probability of
condensation occurring within the PC.