copper water blocks were constructed, one for the processor and one for the
chipset. The cooling blocks were
assembled from 2” x ¼ ” copper bar. Inside
each block a serpentine channel was drilled to allow for maximum cooling.
¼” copper pipe was soldered to ¼” holes drilled into the copper
block for external connections. Copper
pipefittings and ¼” poly tubing was used for fluid interconnections. Both
cooling blocks were pressure tested to 40 psi to assure there was no leakage.
Photos of the water blocks are shown below.